Advances in laser singulation of silicon

ICALEO 2006 - 25th International Congress on Applications of Laser and Electro-Optics, Congress Proceedings

Volumn , Issue , 2006, Pages

  Migliore, Leonard ^a   Lee, Kang Soo ^b   Kim, Jeong Moog ^b   Choi, Byung Kew ^b  

^a Research and Development Department   (United States)

^b HBL Corporation   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

FRACTURE TESTING; FRACTURE TOUGHNESS; LOW-K DIELECTRIC; SAWING; SAWS; SILICON WAFERS; SOLID STATE LASERS;

BEND TESTING; CUTTING CAPACITY; DIODE PUMPED SOLID STATE LASER; EDGE QUALITY; FOCUSED BEAMS; INDIVIDUAL DEVICES; LASER CUTTING; MECHANICAL PROCESS;

PUMPING (LASER);

EID: 56749183511     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.2351/1.5060914     Document Type: Conference Paper

References (7)

1. Toftness, R.F. et al (2005) Laser Technology for Wafer Dicing and Microvia Drilling for Next Generation Wafers, in Photonics West 2005, SPIE, Vol. CDS158:5713-10 pp 54-66
2. Aspnes, D.E., Optical Properites of c-si, in Hull, R., (ed) Properties of Crystalline Silicon, 1999, INSPEC, p. 679
3. Self, S.A. (1983) Focusing of spherical Gaussian beams, Appl. Optics 22(5), 658-661
4. Greuters, J. and Rizvi, N. (2003) UV laser micromachining of silicon, indium phosphide and lithium niobate for telecommunications applications, in Proceedings of the SPIE vol. 4876; Opto-Ireland 2002, pp. 479-486
5. Cotterell, B. et al (2003) The Strength of the Silicon Die in Flip-Chip Assemblies, Journal of Electronic Packaging Vol 125 pp. 114-119
6. Dorner, W. (1999) Using Microsoft Excel for Weibull Analysis, Quality Digest Jan. 1999
7. Perrottet, D. et al (2005) Heat damage-free Laser-Microjet cutting achieves highest die fracture strength, in Photonics West 2005, SPIE, Vol. CDS158:5713-42