Thermal stress analysis of a PQFP moulding process: Comparison of viscoelastic and elastic models

Key Engineering Materials

Volumn , Issue 149 PART II, 1998, Pages 1127-1132

  Park, J H ^a   Kim, J K ^a   Yuen, M M F ^a   Lee, S W R ^a   Tong, P ^a   Chan, P C H ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

Failure Mechanisms; Finite Element Analysis; PQFP; Residual Thermal Stresses; Viscoelastic Moulding Compound

Indexed keywords

EID: 0037802677     PISSN: 10139826     EISSN: 16629795     Source Type: Book Series    
DOI: None     Document Type: Review

References (13)

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