Defects in electronics and their significance for structural integrity

Fatigue and Fracture of Engineering Materials and Structures

Volumn 30, Issue 5, 2007, Pages 432-442

  Plumbridge, W J ^a  

^a OPEN UNIVERSITY   (United Kingdom)

Author keywords

Defect sources; Electronics equipment; Lead free solders; Micromaterials; Size effects; Structural integrity

Indexed keywords

DEFECT STRUCTURES; SOLDERING ALLOYS; STRUCTURAL INTEGRITY;

DEFECT SOURCES; LEAD-FREE TECHNOLOGY; MICROMATERIALS;

ELECTRON DEVICE MANUFACTURE;

EID: 34247620345     PISSN: 8756758X     EISSN: 14602695     Source Type: Journal    
DOI: 10.1111/j.1460-2695.2006.01060.x     Document Type: Article

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