Implementing lead-free solders - The performance aspects

Soldering and Surface Mount Technology

Volumn 18, Issue 1, 2006, Pages 11-18

  Plumbridge, W J ^a,b,c  

^a OPEN UNIVERSITY   (United Kingdom)

^b COST 531 ^*  (United States)

^c European Structural Integrity Society   (United Kingdom)

Author keywords

Acceleration; Failure modes and effects analysis; Service operations; Solders; Variance

Indexed keywords

FAILURE MODES AND EFFECTS ANALYSIS; LEAD-FREE SOLDERS; VARIANCE;

LEAD; RELIABILITY; STRAIN RATE; STRESS ANALYSIS; THERMAL EFFECTS;

SOLDERING ALLOYS;

EID: 33644555535     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910610647071     Document Type: Article

References (10)

1. Cooper, S. and Plumbridge, W.J. (2006), unpublished.
2. Kariya, Y., Morihata, T. and Otsuka, M. (2002), "Mechanical fatigue of lead-free solder alloys", paper presented at the Symposium on Microjoining and Assembly Technology in Electronics, Vol. 8, pp. 437-42.
3. Liu, X.W. and Plumbridge, W.J. (2003), "Thermomechanical fatigue of Sn-37Pb model solder joints", J. Mat. Sci. Eng., Vol. A362, pp. 309-21.
4. Plumbridge, W.J. and Gagg, C.R. (1999), "Effects of strain rate and temperature on the stress-strain response of solder alloys", J. of Mat. Sci. - Mat. Electronics, Vol. 10, pp. 461-8.
5. Plumbridge, W.J. and Gagg, C.R. (2002), "The influence of temperature on the creep of tin-37 lead solders", invited paper presented at the Symposium on Pb-Free and Pb-Bearing Solders, TMS Fall Meeting, Columbus, Ohio.
6. Plumbridge, W.J., Kariya, Y. and Gagg, C.R. (2001), "The influence of processing history on the creep of tin-3.5 silver alloys", paper presented at Seventh Symposium on Microjoining and Assembly Technology in Electronics, MATE 2001 Conference, Yokohama.
7. Plumbridge, W.J., Matela, R.J. and Westwater, A. (2003a), Structural Integrity and Reliability in Electronics - Enhancing Performance in a Lead-Free Environment, Chapters 2 and 3, Kluwer Academic Publishers, Boston, MA.
8. Plumbridge, W.J., Matela, R.J. and Westwater, A. (2003b), Structural Integrity and Reliability in Electronics - Enhancing Performance in a Lead-Free Environment, Chapter 5, Kluwer Academic Publishers, Boston, MA -78.
9. Shi, X.Q., Pang, H.L.J., Zhou, W. and Wang, Z.P. (2000), "Low cycle fatigue analysis of temperature and frequency effects in eutectic solder alloy", Int. J. Fatigue, Vol. 22, pp. 217-28.
10. Sixth European Surface Mount Conference (2004), (SMART Group) Brighton, November.