Thin intergranular films and solid-state activated sintering in nickel-doped tungsten

Acta Materialia

Volumn 55, Issue 9, 2007, Pages 3131-3142

  Gupta, Vivek K ^a   Yoon, Dang Hyok ^a   Meyer III, Harry M ^b   Luo, Jian ^a  

^a AMRL   (United States)

^b OAK RIDGE NATIONAL LABORATORY   (United States)

Author keywords

Grain boundary diffusion; Grain boundary wetting; Interface segregation; Refractory metals; Sintering

Indexed keywords

DOPING (ADDITIVES); GRAIN BOUNDARIES; MATHEMATICAL MODELS; NICKEL; SINTERING; TUNGSTEN;

ACTIVATED SINTERING; GRAIN BOUNDARY DIFFUSION; GRAIN BOUNDARY WETTING; INTERFACE SEGREGATION;

THIN FILMS;

EID: 34247162392     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2007.01.017     Document Type: Article

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