Thermal fatigue and creep fracture behaviors of a nanocomposite solder in microelectronic/optoelectronic packaging

Key Engineering Materials

Volumn 312, Issue , 2006, Pages 237-242

  Zhang, X P ^a,b   Lim, C S H ^b   Mai, Y W ^b   Shi, Y W ^c  

^a SOUTH CHINA UNIVERSITY OF TECHNOLOGY   (China)

^b UNIVERSITY OF SYDNEY   (Australia)

^c BEIJING UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Creep resistance; Fracture; Nano composite solder; Thermal fatigue; Tin lead solder

Indexed keywords

FATIGUE OF MATERIALS; FRACTURE; NANOSTRUCTURED MATERIALS; OPTOELECTRONIC DEVICES; PACKAGING MATERIALS; SOLDERING; THERMAL EFFECTS;

NANO-COMPOSITE SOLDERS; THERMAL CREEP FATIGUE; THERMAL FATIGUE; TIN-LEAD SOLDER;

MICROELECTRONICS;

PACKAGING;

EID: 33645751542     PISSN: 10139826     EISSN: 16629795     Source Type: Book Series    
DOI: 10.4028/0-87849-994-6.237     Document Type: Article

References (11)

1. W.J. Plumbridge: Journal of Materials Science Vol. 31 (1996), p. 2501.
2. D. Shangguan and G. Gao: Soldering and Surface Mount Technology Vol. 26 (1997), p. 5.
3. F. Hua and J. Glazer: Design and Reliability of Solder Interconnections, Mahidhara, R K, Frear, D R, Sastry, S M L et al. Eds. (MMMS, Pennsylvania, USA, 1997), p. 65.
4. B.P. Richards, C.L. Levoguer, C.P. Hunt, K. Nimmo, S. Peters and P. Cusack: Report, (Department of Trade & Industry, UK, 1999), p. 1.
5. L. Dom, F. Herbert and S. Shrestha: Proceedings of System Integration in Micro Electronics, Exhibitions & Conference, Nuernberg, Germany, 27-29 July 2000, p.349.
6. E. Bradley and J. Hranisavljevic: IEEE Transactions on Electronic Packaging Manufacturing Vol.24 (2001), p.255.
7. Z.G. Chen, Y.W. Shi and Z.D. Xia: Journal of Electronic Materials Vol.31 (2002), p.1122.
8. K.N. Tu, A.M. Gusak and M. Li: Journal of Applied Physics Vol.93 (2003), p. 1335.
9. X.P. Zhang, H.W. Wang and Y.W. Shi: Journal of Materials Science: Materials in Electronics Vol.15 (2004), p. 511.
10. Y.W. Shi: China-European Union Workshop on Materials Strategy for New Millenium, Beijing, China, 8 Dec. 2000, p. 39.
11. G. Elger, M. Hutter, H. Oppermann, R. Aschenbrenner, H. Reichl and E. Jaeger: Microsystem Technologies Vol.7 (2002), p. 239.