Comparative analysis of BGA deformations and strains using digital image correlation and moiré interferometry

Proceedings of the 2005 SEM Annual Conference and Exposition on Experimental and Applied Mechanics

Volumn , Issue , 2005, Pages 1873-1880

  Park, Seungbae ^a   Dhakal, Ramji ^a   Joshi, Rahul ^a  

^a State University of New York at Binghamton   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEFORMATION MEASUREMENT; DIGITAL IMAGE CORRELATION (DIC); TECHNICAL COMMUNITY;

ALGORITHMS; DEFORMATION; ELECTRONICS PACKAGING; MICROPROCESSOR CHIPS; STRAIN; THERMAL CYCLING; THERMOMECHANICAL TREATMENT;

SOLDERED JOINTS;

EID: 32044450516     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)

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