메뉴 건너뛰기




Volumn 30, Issue 1, 2007, Pages 3-8

Pressure drop and heat transfer correlations for triangular folded fin heat sinks

Author keywords

Duct flow; Plate fin; Pressure drop; Thermal resistance; Triangular folded fin

Indexed keywords

DUCTS; FRICTION; HEAT RESISTANCE; HEAT TRANSFER; PRESSURE DROP; REYNOLDS NUMBER;

EID: 34147100027     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2006.885943     Document Type: Article
Times cited : (7)

References (14)
  • 1
    • 34147093471 scopus 로고    scopus 로고
    • Intel, Thermal Management for Boxed Intel Pentium 4 Processor in the 775-Land Package, Tech. Rep., 2006 [Online]. Available: http:// www.intel.com/cd/channel/reseller/asmo-na/eng/Products/box_processors/ desktop/proc_dsk_p4/technical_reference/99346.htm/
    • Intel, "Thermal Management for Boxed Intel Pentium 4 Processor in the 775-Land Package," Tech. Rep., 2006 [Online]. Available: http:// www.intel.com/cd/channel/reseller/asmo-na/eng/Products/box_processors/ desktop/proc_dsk_p4/technical_reference/99346.htm/
  • 2
    • 0035364699 scopus 로고    scopus 로고
    • Design for manufacturability of SISE parallel-plate forced convection heat sinks
    • Jun
    • M. Iyengar and A. Bar-Cohen, "Design for manufacturability of SISE parallel-plate forced convection heat sinks," IEEE Trans. Compon. Packag. Technol., vol. 24, no. 2, pp. 150-158, Jun. 2001.
    • (2001) IEEE Trans. Compon. Packag. Technol , vol.24 , Issue.2 , pp. 150-158
    • Iyengar, M.1    Bar-Cohen, A.2
  • 3
    • 0033332763 scopus 로고    scopus 로고
    • Analytical modeling of forced convection in slotted plate fin heat sink
    • P. Teertstra, J. R. Culham, and M. M. Yovanovich, "Analytical modeling of forced convection in slotted plate fin heat sink," ASME HTD, vol. 364-1, pp. 3-11, 1999.
    • (1999) ASME HTD , vol.364 -1 , pp. 3-11
    • Teertstra, P.1    Culham, J.R.2    Yovanovich, M.M.3
  • 4
    • 1842430460 scopus 로고    scopus 로고
    • Thermal performance analysis of fan-heat sinks for CPU cooling
    • Washington, DC, CD ROM
    • S. Y. Kim and R. L. Webb, "Thermal performance analysis of fan-heat sinks for CPU cooling," in Proc. ASME IMECE'03, Washington, DC, 2003, [CD ROM].
    • (2003) Proc. ASME IMECE'03
    • Kim, S.Y.1    Webb, R.L.2
  • 5
    • 0033877493 scopus 로고    scopus 로고
    • Thermal and hydraulic behavior of plate fin and strip fin heat sinks under varying bypass conditions
    • Mar
    • H. Jonsson and B. Palm, "Thermal and hydraulic behavior of plate fin and strip fin heat sinks under varying bypass conditions," IEEE Trans. Compon. Packag. Technol., vol. 23, no. 1, pp. 47-54, Mar. 2000.
    • (2000) IEEE Trans. Compon. Packag. Technol , vol.23 , Issue.1 , pp. 47-54
    • Jonsson, H.1    Palm, B.2
  • 6
    • 0035363425 scopus 로고    scopus 로고
    • Thermnal characterization of a liquid cooled AlSiC base plate with integral pin fins
    • Jun
    • K. A. Moores, Y. K. Joshi, and G. H. Schiroky, "Thermnal characterization of a liquid cooled AlSiC base plate with integral pin fins," IEEE Trans. Compon. Packag. Technol., vol. 24, no. 2, pp. 213-219, Jun. 2000.
    • (2000) IEEE Trans. Compon. Packag. Technol , vol.24 , Issue.2 , pp. 213-219
    • Moores, K.A.1    Joshi, Y.K.2    Schiroky, G.H.3
  • 7
    • 0038818518 scopus 로고    scopus 로고
    • Thermal performance of aluminum-foam heat sinks by forced air cooling
    • Mar
    • S. Y. Kim, J. W. Paek, and B. H. Kang, "Thermal performance of aluminum-foam heat sinks by forced air cooling," IEEE Trans. Compon. Packag. Technol., vol. 26, no. 1, pp. 262-267, Mar. 2003.
    • (2003) IEEE Trans. Compon. Packag. Technol , vol.26 , Issue.1 , pp. 262-267
    • Kim, S.Y.1    Paek, J.W.2    Kang, B.H.3
  • 8
    • 0035931827 scopus 로고    scopus 로고
    • Forced convection from aluminum foam materials in an asymmetrically heated channel
    • S. Y. Kim, B. H. Kang, and J. H. Kim, "Forced convection from aluminum foam materials in an asymmetrically heated channel," Int. J. Heat Mass Transfer, vol. 44, pp. 1451-1454, 2001.
    • (2001) Int. J. Heat Mass Transfer , vol.44 , pp. 1451-1454
    • Kim, S.Y.1    Kang, B.H.2    Kim, J.H.3
  • 10
    • 0024739538 scopus 로고
    • Convective heat transfer from longitudal fin arrays in the entry region of turbulent flow
    • K. S. Lau and R. L. Mahajan, "Convective heat transfer from longitudal fin arrays in the entry region of turbulent flow," J. Electron. Packag., vol. 111, pp. 213-219, 1989.
    • (1989) J. Electron. Packag , vol.111 , pp. 213-219
    • Lau, K.S.1    Mahajan, R.L.2
  • 13
    • 0029378553 scopus 로고
    • Cooling performance of plate fins for multichip modules
    • Sep
    • H. Iwasaki, T. Sasaki, and M. Ishizuka, "Cooling performance of plate fins for multichip modules," IEEE Trans. Compon. Packag. Technol. vol. 18, no. 3, pp. 592-595, Sep. 1995.
    • (1995) IEEE Trans. Compon. Packag. Technol , vol.18 , Issue.3 , pp. 592-595
    • Iwasaki, H.1    Sasaki, T.2    Ishizuka, M.3
  • 14
    • 84950138629 scopus 로고    scopus 로고
    • Heat rejection limits of air cooled plate fin heat sinks for computer cooling
    • M. Saini and R. L. Webb, "Heat rejection limits of air cooled plate fin heat sinks for computer cooling," in Proc. I-THERM'02, 2002, pp. 1-8.
    • (2002) Proc. I-THERM'02 , pp. 1-8
    • Saini, M.1    Webb, R.L.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.