Thermal performance analysis of fan-heat sinks for CPU cooling

American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD

Volumn 374, Issue 2, 2003, Pages 235-243

  Kim, Seo Young ^a   Webb, Ralph L ^b  

^a Korea Institute of Science and Technology   (South Korea)

^b PENNSYLVANIA STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER HARDWARE; FANS; FRICTION; HEAT RESISTANCE; JETS; LAMINAR FLOW; NUSSELT NUMBER; PRESSURE DROP; REYNOLDS NUMBER; SURFACE PHENOMENA;

AIRFLOW RATE; PLATE-FIN HEAT SINK;

HEAT SINKS;

EID: 1842430460     PISSN: 02725673     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2003-42172     Document Type: Conference Paper

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