Thermal performance of aluminum-foam heat sinks by forced air cooling

IEEE Transactions on Components and Packaging Technologies

Volumn 26, Issue 1, 2003, Pages 262-267

  Kim, Seo Young ^a   Paek, Jin Wook ^a   Kang, Byung Ha ^b  

^a Korea Institute of Science and Technology   (South Korea)

^b Kookmin University   (South Korea)

Author keywords

Aluminum foam heat sink; Electronics cooling; Forced convection; Parallel plate heat sink; Thermal resistance

Indexed keywords

ALUMINUM; COOLING SYSTEMS; FOAMS; FORCED CONVECTION; HEAT FLUX; HEAT RESISTANCE; NUSSELT NUMBER; POROSITY; REYNOLDS NUMBER; THIN FILMS;

ALUMINUM-FOAM HEAT SINK; ELECTRONICS-COOLING DEVICE; FORCED AIR COOLING; HEAT SOURCE; PARALLEL-PLATE HEAT SINK;

HEAT SINKS;

EID: 0038818518     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2003.809540     Document Type: Article

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