Heat rejection limits of air cooled plane fin heat sinks for computer cooling

InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM

Volumn 2002-January, Issue , 2002, Pages 1-8

  Saini, M ^a   Webb, R L ^a  

^a PENNSYLVANIA STATE UNIVERSITY   (United States)

Author keywords

Central Processing Unit; Cooling; Ducts; Geometry; Heat sinks; Space heating; Surface resistance; Temperature; Thermal conductivity; Thermal resistance

Indexed keywords

COOLING; DUCTS; FINS (HEAT EXCHANGE); GEOMETRY; HEAT SINKS; PERSONAL COMPUTERS; PROGRAM PROCESSORS; SPACE HEATING; SURFACE RESISTANCE; TEMPERATURE; THERMAL CONDUCTIVITY;

COMPUTER COOLING; CONVECTION RESISTANCE; FIN GEOMETRY; FIN HEAT SINKS; HEAT REJECTION; IMPINGING FLOW; OFFSET STRIP; OPTIMUM GEOMETRY;

HEAT RESISTANCE;

EID: 84950138629     PISSN: 19363958     EISSN: None     Source Type: Journal    
DOI: 10.1109/ITHERM.2002.1012431     Document Type: Article

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