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Volumn 25, Issue 1, 2007, Pages 208-212

Orogenic movement mechanism for the formation of symmetrical relief features in copper nitride thin films

Author keywords

[No Author keywords available]

Indexed keywords

COPPER COMPOUNDS; CRACKING (CHEMICAL); ELECTRON MOBILITY; FILM GROWTH; NANOSTRUCTURED MATERIALS; THERMODYNAMIC STABILITY;

EID: 34047164201     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.2433970     Document Type: Article
Times cited : (4)

References (19)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.