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Volumn 25, Issue 1, 2007, Pages 208-212
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Orogenic movement mechanism for the formation of symmetrical relief features in copper nitride thin films
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Author keywords
[No Author keywords available]
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Indexed keywords
COPPER COMPOUNDS;
CRACKING (CHEMICAL);
ELECTRON MOBILITY;
FILM GROWTH;
NANOSTRUCTURED MATERIALS;
THERMODYNAMIC STABILITY;
ATOMIC MOBILITY;
COPPER NITRIDE;
OROGENIC MOVEMENT;
THIN FILMS;
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EID: 34047164201
PISSN: 10711023
EISSN: None
Source Type: Journal
DOI: 10.1116/1.2433970 Document Type: Article |
Times cited : (4)
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References (19)
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