Packaging of power electronics for high temperature applications

Advancing Microelectronics

Volumn 25, Issue 1, 1998, Pages 19-24

  McCluskey, Patrick ^a   Das, Diganta ^a   Jordan, Jill ^a   Condra, Lloyd ^b   Grzybowski, Richard R ^c   Torri, Thomas C ^d   Fink, John ^e  

^a UNIVERSITY OF MARYLAND   (United States)

^b BOEING COMPANY   (United States)

^c UNITED TECHNOLOGIES RESEARCH CENTER   (United States)

^d DELPHI CORPORATION   (United States)

^e HONEYWELL TECHNOLOGY CENTER   (United States)

Author keywords

Capacitors; Electronic packaging; High temperature electronics; Power electronics; Semiconductors; Solders; Wirebonds

Indexed keywords

EID: 57649215870     PISSN: None     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (13)

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13. P. McCluskey, D. Das, J. Jordan, L. Condra, T. C. Torri, J. Fink, and R. R. Grzybowski, "Packaging of Electronics for High Temperature Environments," Paper accepted for Publication in The International Journal of Microcircuits and Electronic Packaging, IMAPS Publication, Vol. 20, No. 3, Third Issue, 1997.