Transient liquid-phase bonding in the NiAI/Cu/Ni system -a microstructural investigation

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Volumn 27, Issue 11, 1996, Pages 3621-3629

  Gale, W F ^a   Guan, Y ^a  

^a AUBURN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE JOINTS; AUSTENITE; BONDING; CRYSTAL MICROSTRUCTURE; INTERMETALLICS; METAL MELTING; METALLOGRAPHIC MICROSTRUCTURE; PRECIPITATION (CHEMICAL); SCANNING ELECTRON MICROSCOPY; SOLIDIFICATION; TRANSMISSION ELECTRON MICROSCOPY;

COPPER INTERLAYERS; TRANSIENT LIQUID PHASE BOND;

TERNARY SYSTEMS;

EID: 0030285592     PISSN: 10735623     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF02595453     Document Type: Article

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