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Volumn 695, Issue , 2002, Pages 27-32
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Residual stress and microstructure of electroplated Cu film on different barrier layers
a b a a a c |
Author keywords
[No Author keywords available]
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Indexed keywords
ADHESION;
ANNEALING;
CRYSTAL GROWTH;
CRYSTAL MICROSTRUCTURE;
ELECTROPLATING;
RESIDUAL STRESSES;
SILICON WAFERS;
SINGLE CRYSTALS;
STRESS CONCENTRATION;
TENSILE STRESS;
THERMAL CYCLING;
THICKNESS MEASUREMENT;
STRESS GRADIENT;
STRESS TEMPERATURE CYCLING MEASUREMENT;
X RAY POLE FIGURE;
COPPER;
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EID: 0036351982
PISSN: 02729172
EISSN: None
Source Type: Journal
DOI: None Document Type: Article |
Times cited : (16)
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References (19)
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