Analysis of phosphorus flame retardant induced leakage currents in IC packages using SQUID microscopy

IEEE Transactions on Components and Packaging Technologies

Volumn 29, Issue 4, 2006, Pages 804-808

  Deng, Yuliang ^a,b   Pecht, Michael ^a,b   Rogers, Keith ^a,b  

^a IEEE   (United States)

^b UNIVERSITY OF MARYLAND   (United States)

Author keywords

Flame retardant; Green mold compound; Red phosphorus; Superconducting quantum interference device (SQUID)

Indexed keywords

ENCAPSULATED SEMICONDUCTOR DEVICES; GREEN MOLD COMPOUND; LEAKAGE CURRENT PATH;

ELECTRONICS PACKAGING; ENCAPSULATION; LEAKAGE CURRENTS; PHOSPHORUS; QUANTUM THEORY; SQUIDS;

FLAME RETARDANTS;

EID: 33947276280     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2006.885960     Document Type: Article

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