Scanning SQUID microscopy for new package technologies

Proceedings of the 30th International Symposium for Testing and Failure Analysis, ISTFA 2004

Volumn , Issue , 2004, Pages 67-72

  Pacheco, Mario ^a   Wang, Zhiyong ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE; COMPUTER AIDED DESIGN; CURRENT DENSITY; DIES; ELECTRIC FAULT CURRENTS; ELECTRIC RESISTANCE; ELECTRONICS PACKAGING; FAILURE ANALYSIS; MICROELECTRONICS; NONDESTRUCTIVE EXAMINATION; RELIABILITY; SOFTWARE ENGINEERING; X RAY ANALYSIS;

ELECTRIC DEFECTS; FAULT ISOLATION; MAGNETIC-DIFFERENTIAL IMAGES; SCANNING SQUID MICROSCOPES (SSM);

SQUIDS;

EID: 10444251891     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. Rajen Dias, Rama Goruganthu, Deepak Goyal, Cheryl Hratfield, Doug Hunt, Dick McMclelland, Jim Cargo, Gay Samuelson, Roger Stierman, Assembly Analytical Forum Analytical Tool Roadmap White Paper, International SEMATECH White Paper. ISTFA
2. Rajen Dias, Lars Skoglund, Zhiyong Wang, David Smith, Integration of SQUID Microscopy into FA Flow, ISTFA 2001.
3. Antonio Orozco and Zhiyong Wang et. al, Fault Isolation of High Resistance Defects using Comparative Magnetic Field Imaging, ISTFA 2003