Low-loss integrated-waveguide passive circuits using liquid-crystal polymer system-on-Package (SOP) technology for millimeter-wave applications

IEEE Transactions on Microwave Theory and Techniques

Volumn 54, Issue 12, 2006, Pages 4572-4578

  Yang, Ki Seok ^a,b   Pinel, Stephane ^a,b   Kim, Il Kwon ^a,b   Laskar, Joy ^a,b  

^a IEEE   (United States)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Bandpass filter (BPW); Integrated waveguide (IWG); Liquid crystal polymer (LCP); Millimeter wave; Packaging; System on package (SOP)

Indexed keywords

INTEGRATED WAVEGUIDE (IWG); MILLIMETER WAVE PACKAGING; SYSTEM ON PACKAGE (SOP);

BANDPASS FILTERS; ELECTRIC LINES; ELECTRONICS PACKAGING; INSERTION LOSSES; LIQUID CRYSTAL POLYMERS; MAGNETOELECTRIC EFFECTS; MILLIMETER WAVES; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS;

PASSIVE NETWORKS;

EID: 33847755962     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/TMTT.2006.886004     Document Type: Article

References (14)

1. D. Thompson, J. Papapolymerou, and M. Tentzeris, "High temperature dielectric stability of liquid crystal polymer at mm-wave frequencies," in Plastics, J. Peters, Ed., 2nd ed. New York: McGraw-Hill, 1964, vol. 3, pp. 15-64.
2. M. M. Tentzeris, J. Laskar, J. Papapolymerou, S. Pinel, V. Palazzari, R. Li, G. DeJean, N. Papageorgiou, D. Thompson, R. Bairavasubamanian, S. Sarkar, and J. H. Lee, "3-D-integrated RF and millimeter-wave functions and modules using liquid-crystal polymer (LCP) system-on-package technology," IEEE Trans. Microw. Theory Tech., vol. 52, no. 5, pp. 332-340, May 2004.
3. J. Lee, G. Dejean, S. Sairkar, S. Pinel, K. Lim, J. Papapolymerou, J. Laskar, and M. M. Tentzeris, "Highly integrated millimeter-wave passive components using 3-D LTCC system-on-package (SOP) technology," IEEE Trans. Microw. Theory Tech., vol. 53, no. 6, pp. 2220-2229, Jun. 2005.
4. K. Yang, S. Pinel, I. K. Kim, and J. Laskar, "Millimeter-wave low-loss integrated waveguide on liquid crystal polymer substrate," in IEEE MTT-S Int. Microw. Symp. Dig., San Francisco, CA, Jun. 2006, pp. 965-968.
5. D. C. Thompson, O. Tantot, H. Jallageas, G. E. Ponchak, M. M. Tentzeris, and J. Papapolymerou, "Characterization of liquid-crystal polymer (LCP) material and transmission lines on LCP substrates from 30 to 110 GHz," IEEE Trans. Microw. Theory Tech., vol. 52, no. 4, pp. 1343-1352, Apr. 2004.
6. D. C. Thompson, J. Papapolymerou, and M. M. Tentzeris, "High temperature dielectric stability of liquid crystal polymer at mm-wave frequencies," IEEE Microw. Wireless Compon. Lett., vol. 15, no. 9, pp. 561-563, Sep. 2005.
7. S. Choi, K. Yang, K. Tokuda, and Y. Kim, "A V-band planar narrow bandpass filter using a new type integrated waveguide transition," IEEE Microw. Wireless Compon. Lett., vol. 14, no. 12, pp. 545-547, Dec. 2004.
8. "Multical User's Guide," NIST, Boulder, CO, 1995.
9. M. Ito, K. Maruhashi, K. Ikuina, T. Hashiguchi, S. Iwanaga, and K. Ohata, "A 60-GHz-band planar dielectric waveguide filter for flip-chip modules," IEEE Trans. Microw. Theory Tech., vol. 49, no. 12, pp. 2431-2436, Dec. 2001.
10. G. L. Matthaei, L. Young, and E. M. T. Jones, Microwave Filters, Impedance-Matching Networks, and Coupling Structures. North Bergen, NJ: Bookmart, 1985.
11. L. Harle and L. P. B. Katehi, "A vertically integrated micromachined filter," IEEE Trans. Microw. Theory Tech., vol. 50, no. 9, pp. 2063-2068, Sep. 2002.
12. P. Blondy, A. R. Brown, D. Cros, and G. M. Rebeiz, "Low-loss micromachined filters for millimeter-wave communication," IEEE Trans. Microw. Theory Tech., vol. 46, no. 12, pp. 2283-2288, Dec. 1998.
13. M. Heijnigen and G. Gauthier, "Low-cost millimeter-wave transceiver module using SMD packaged MMICs," in Proc. Eur. Microw. Conf., Sep. 2004, pp. 1269-1272.
14. R. Valois, D. Baillargeat, S. Verdeyme, M. Lahti, and T. Jaakola, "High performances of shielded LTCC vertical transitions from DC up to 50 GHz," IEEE Trans. Microw. Theory Tech., vol. 53, no. 6, pp. 2026-2032, Jun. 2005.