Stainless steel foil substrates: Robust, low-cost, flexible active-matrix backplane technology

Proceedings of International Meeting on Information Display

Volumn 2, Issue , 2006, Pages 892-896

  Hong, Yongtaek ^a   Heller, Gregory ^a   Cheng, I Chun ^b   Kattamis, Alex ^b   Wagner, Sigurd ^b  

^a EASTMAN KODAK COMPANY   (United States)

^b Princeton University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DISPLAY DEVICES; ELECTRIC INSULATION; HIGH DEFINITION TELEVISION; LIGHT EMITTING DIODES; PASSIVATION; STAINLESS STEEL; SURFACE ROUGHNESS;

CAPACITIVE COUPLING; CONDUCTIVE SUBSTRATES; PLANARIZATION; STAINLESS STEEL FOIL;

METAL FOIL;

EID: 33847406759     PISSN: 17387558     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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