Stress-Induced Deformation of Aluminum Metallization in Plastic Molded Semiconductor Devices

IEEE Transactions on Components, Hybrids, and Manufacturing Technology

Volumn 8, Issue 4, 1985, Pages 427-434

  Thomas, Ronald E ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING - STRESSES; PLASTICS - MOLDING; SEMICONDUCTOR DEVICES - ENCAPSULATION; THERMAL EFFECTS;

EPOXY MOLD COMPOUNDS EVALUATION; PLASTIC-MOLDED DEVICES METALLIZATION; STRESS-INDUCED DEFORMATION; TEMPERATURE CYCLED PACKAGES;

ALUMINUM AND ALLOYS;

EID: 0022313453     PISSN: 01486411     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCHMT.1985.1136541     Document Type: Article

References (14)

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