Experimental characterization of flow boiling heat dissipation in a microchannel heat sink with different orientations

Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005

Volumn 2, Issue , 2005, Pages 670-676

  Zhang, H Y ^a   Pinjala, D ^a   Wong, T N ^b  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

BOILING LIQUIDS; HEAT RESISTANCE; HEAT SINKS; INTERFACES (MATERIALS); PRESSURE DROP; THERMODYNAMICS;

CONTACT RESISTANCE; FLOW BOILING; MICROCHANNELS; SLUG FLOW;

ENERGY DISSIPATION;

EID: 33847280532     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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