Nonuniform temperature distribution in electronic devices cooled by flow in parallel microchannels

IEEE Transactions on Components and Packaging Technologies

Volumn 24, Issue 1, 2001, Pages 16-23

  Hetsroni, G ^a   Mosyak, A ^a   Segal, Z ^a  

^a TECHNION ISRAEL INSTITUTE OF TECHNOLOGY   (Israel)

Author keywords

Flow pattern; Hydrodynamic instabilities; Parallel microchannels; Thermal irregularity; Thermal pattern

Indexed keywords

COOLING; FLOW PATTERNS; FORCED CONVECTION; HEAT FLUX; HYDRAULICS; TEMPERATURE DISTRIBUTION; TEMPERATURE MEASUREMENT;

PARALLEL MICROCHANNELS; THERMAL MICROSYSTEMS;

MICROPROCESSOR CHIPS;

EID: 0035278849     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.910797     Document Type: Article

References (11)

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