Investigation of interfacial delamination of a copper-epoxy interface under monotonic and cyclic loading: Experimental characterization

IEEE Transactions on Advanced Packaging

Volumn 26, Issue 4, 2003, Pages 447-452

  Xie, Weidong ^a   Sitaraman, Suresh K ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Delamination propagation; Fatigue crack propagation; Interfacial fracture toughness

Indexed keywords

COPPER; CRACK PROPAGATION; DELAMINATION; DESIGN FOR TESTABILITY; EPOXY RESINS; FRACTURE TESTING; INTERFACES (MATERIALS); SUBSTRATES; TENSILE TESTING; THIN FILMS;

COPPER EPOXY INTERFACE; CYCLIC LOADING; FATIGUE CRACK PROPAGATION; INTERFACIAL DELAMINATION; INTERFACIAL FRACTURE TOUGHNESS; MONOTONIC LOADING;

ELECTRONICS PACKAGING;

EID: 0742286398     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2003.821091     Document Type: Article

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