Fatigue crack growth behavior of 95Pb-5Sn solder under various stress ratios and frequencies

International Journal of Fatigue

Volumn 22, Issue 8, 2000, Pages 665-673

  Zhao, J ^a   Miyashita, Y ^a   Mutoh, Y ^a  

^a NAGAOKA UNIVERSITY OF TECHNOLOGY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK PROPAGATION; FATIGUE OF MATERIALS; FATIGUE TESTING; FRACTURE MECHANICS; GRAIN SIZE AND SHAPE; LEAD ALLOYS; RECRYSTALLIZATION (METALLURGY); STRESS ANALYSIS;

CYCLE-DEPENDENT CRACK GROWTHS; INTERGRANULAR CRACK GROWTHS;

SOLDERING ALLOYS;

EID: 0034274787     PISSN: 01421123     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0142-1123(00)00065-7     Document Type: Article

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