Moisture effects on the creep of thermosetting IC packaging polymers

7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006

Volumn 2006, Issue , 2006, Pages

  Ma, Xiaosong ^a   Jansen, K M B ^a   Ernst, L J ^a  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

EPOXY NOVOLAC POLYMERS; FICKIAN DIFFUSION; HUMIDITY CHAMBER; MOISTURE ABSORPTION TESTS;

ATMOSPHERIC HUMIDITY; CREEP; DIFFUSION; ELECTRONICS PACKAGING; MOISTURE; VISCOELASTICITY;

POLYMERS;

EID: 33847112526     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2006.1644008     Document Type: Conference Paper

References (19)

1. A. Ishisaka, M. Kawagoe Examination of the Time-Water Content Superposition on the Dynamic Viscoelasticity of Moistened Polyamide 6 and Epoxy Journal of Applied Polymer Science, Vol. 93, No.2(2004), 560-567.
2. P.Nogueira, et al, "Effect of Water Sorption on the Structure and Mechanical Properties of an Epoxy Resin System," J. of Applied Polymer Science, Vol. 80, No. 1 (2001), pp. 71-80.
3. Sunil K. Karad, et al "Mechanisms of moisture absorption by cyanate ester modified epoxy resin matrices: the clustering of water molecules," Polymer Vol. 46,No.8 (2005), pp. 2732-2738.
4. Gabriel LaPlante, et al, "Moisture Effects on FM300 Structural Film Adhesive: Stress Relaxation, Fracture Toughness, and Dynamic Mechanical Analysis," Journal of Applied Polymer Science, Vol. 95, No.5 (2005), pp.1285-1294.
5. S.-M. Zhou,et al "Confirmation of Universality of Time-Humidity Superposition Principle for Various Water-Absorbable Polymers through Dynamic Viscoelastic Measurements under Controlled Conditions of Relative Humidity and Temperature," Journal of Polymer Science: Part B: Polymer Physics, Vol. 39, No. 14 (2001), pp.1638-1650.
6. Gupta V.B, et al, "The Physical Basis of Moisture Transport in a Cured Epoxy-resin System," Journal of Applied Polymer Science Vol. 30 No.11(1985) pp. 4467-4493.
7. Li-Rong Bao, et al, "Moisture Absorption and Hygrothermal Ageing in a Bismaleimide Resin," polymer, Vol. 42, No. 17 (2001), pp. 7327-7333.
8. A.Apicella et al, "Water sorption and Mechanical Properties of a glass-reinforced polyester resin," Composites, Vol.13, No.4 (1982), pp. 406-410.
9. Shijian Luo, "Moisture Absorption in Uncured Underfill Materials," IEEE Transactions on components and Packaging Technologies, Vol. 27, No. 2 (2004), pp. 345-351.
10. Haleh Ardebili, et al, "Hygroscopic Swelling and Sorption Characteristics of Epoxy Molding Compounds Used in Electronic Packaging'" IEEE, Transactions on components and Packaging Technologies Vol. 26, No. 1 (2003), pp. 203-214.
11. E. H. Wong R. Rajoo,S. W. Koh, T. B. Lim, "The Mechanics and Impact of Hygroscopic Swelling of Polymeric Materials in Electronic Packaging," Journal of Electronic Packaging, Vol. 124, No.2 (2002), pp. 123-126.
12. P. Gonon, et al, "Combined Effects of Humidity and Thermal Stress on the Dielectric Properties of Epoxy-Silica Composites," Materials Science and Engineering B,Solid State for Advanced Materials,Vol. 83, No.(1-3) (2001), pp. 158-164.
13. W.D.van Driel et al, Prediction of Delamination in Micro-electronic Packaging," IEEE 6th International Conference on Electronic Packaging Technology, Shenzhen, China, Aug. 2005, pp.676-681.
14. W.D.van. Driel et al, "Characterization of Interface Strength as Function of Temperature and Moisture," IEEE 6th International Conference on Electronic Packaging Technology, Shenzhen, China, Aug. 2005, pp.687-692.
15. J.C.Phillips, "Stress Relaxation of Elongated Strips of Poly(Vinylidene Fluoride) in Ethyl Acetate Vapor," Polyemr engineering and Science, Vol. 37, No. 2 (1997), pp.291-305.
16. Shumei Zhou, et al, " Influence of Water on Structure and Mechanical properties of Regenerated Cellilose Studied by Organized Combination of Infraed Spectra, X-ray Diffraction, and Dynamic Viscoelastic Data measured as Functions of temperature and humidity," Macromolecules, Vol. 34, No.5 (2001), pp1274-1280.
17. Shumei Zhou, et al, "Moisture Effect on Structure and Mechanical Property of Nylon 6 as Studied by the Time- resolved and Simultaneous Measurements of FT-IR and Dynamic Viscoelasticity under the cntrolled Humidity at Constant Scanning Rate," Polymer J. Vol. 33, No. 4(2001), pp.344-355.
18. Sunil K. Karada, Frank R. Jonesb, David Attwoodc, "Moisture absorption by cyanate ester modified epoxy resin matrices. Part I. Effect of spiking parameters," Polymer, Vol. 43, No.19 (2002), pp.5209-5218.
19. Halpin, J.C. in Composite Materials Workshop; Tsai, S.W.;Halpin,J. C.; Pagano, N.J.;Technomic:Lancaster, PA, 1968;pp.87-152.