Characterization of interface strength as function of temperature and moisture conditions

2005 6th International Conference on Electronics Packaging Technology

Volumn 2005, Issue , 2005, Pages

  Van Driel, W D ^a,c   Habets, P J J H A ^d   Van Gils, M A J ^a,b   Zhang, G Q ^a,c  

^a NXP SEMICONDUCTORS   (Netherlands)

^b PHILIPS RESEARCH LABORATORIES   (Netherlands)

^c DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

^d EINDHOVEN UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; FRACTURE MECHANICS; FRACTURE TOUGHNESS; MICROELECTRONICS; MOISTURE; NUMERICAL METHODS;

CRITICAL LOADS; INTERFACIAL STRENGTH; MODE MIXITY; MOISTURE SENSITIVITY LEVEL (MSL);

INTERFACES (MATERIALS);

EID: 33846317764     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2005.1564623     Document Type: Conference Paper

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