Wafer-scale packaging of RF MEMS for 50-90 GHz

2006 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems - Digest of Papers

Volumn 2006, Issue , 2006, Pages 32-34

  Morton, Matthew A ^a   Guoan, Wang ^a   Papapolymerou, John ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Interconnect; Packaging; RF MEMS packaging; SOC; SOP

Indexed keywords

CAPACITANCE; ELECTRONICS PACKAGING; IDENTIFICATION (CONTROL SYSTEMS); OPTICAL INTERCONNECTS; SILICON WAFERS;

RF MEMS PACKAGING; SOC; SOP;

MICROELECTROMECHANICAL DEVICES;

EID: 33847083569     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SMIC.2005.1587896     Document Type: Conference Paper

References (7)

1. H.A.C Tilmans, et al., "Wafer-level Packaged RF-MEMS Switches Fabricated in a CMOS Fab," IEDM Technical Digest, Int., pp. 41.4.1-41.4.4, Dec. 2001.
2. Y. Cheng, L. Lin and K. Najafi, "A Hermetic Glass-Silicon Package Formed Using Localized Aluminum/Silicon-Glass Bonding," Journal of Microelectromechanical Systems, Vol. 10, no. 3, pp. 392-399, 2001.
3. J. P. Becker and L. P. Katehi, "Multilevel Finite Ground Coplanar Line Transitions For High-Density Using Silicon Micromachinging," in Proc. IEEE MTT-S Int. Microwave Symposium, pp. 303-306, June 2000.
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5. Morton, M.A.; Papapolymerou, J.; "Wide-band Finite Ground Coplanar (FGC) Interconnects for On-chip Packaging of RF MEMS Switches Used in Smart Antennas and Phased Arrays," Antennas and Wireless Propagation Letters., Vol. 3, no. 1, pp. 239-242, 2004.
6. Byung-Wook Min; Entesari, K.; Rebeiz, G.M.;, "Dc-50 GHz low-loss wafer-scale package for RF MEMS," Microwave Conference, 2004. 34th European Volume 3, 11-15 Oct. 2004 pp.1289 - 1291.
7. G. Zheng, P. Kirby, A. Rodriguez, J. Papapolymerou, M. Tentzeris and L. Dunleavy, "Design and On-Wafer Measurement of a W-Band Via-Less CPW RF Probe Pad to Microstrip Transition," in Proc. 33rd European Microwave Conf., pp. 443 - 446, Oct. 2003.