Wide-band finite ground coplanar (FGC) interconnects for on-chip packaging of RF MEMS switches used in smart antennas and phased arrays

IEEE Antennas and Wireless Propagation Letters

Volumn 3, Issue 1, 2004, Pages 239-242

  Morton, Matthew A ^a   Papapolymerou, John ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Interconnect; Packaging; RF MEMS packaging; System on chip (SOC); System on package (SOP)

Indexed keywords

ANTENNA PHASED ARRAYS; ATTENUATION; COST EFFECTIVENESS; ELECTRIC SWITCHES; ELECTRONICS PACKAGING; MICROELECTROMECHANICAL DEVICES;

INTERCONNECT; RADIO FREQUENCY (RF) MEMS PACKAGING; SYSTEM-ON-CHIP (SOC); SYSTEM-ON-PACKAGE (SOP);

OPTICAL INTERCONNECTS;

EID: 11944268358     PISSN: 15361225     EISSN: None     Source Type: Journal    
DOI: 10.1109/LAWP.2004.836573     Document Type: Article

References (9)

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