-
1
-
-
0031249261
-
Spiral inductors and transmission lines in silicon technology using copper-damascene interconnects and low-loss substrates
-
Oct
-
J. N. Burghartz, D. C. Edelstein, K. A. Jenkins, and Y. H. Kwark, "Spiral inductors and transmission lines in silicon technology using copper-damascene interconnects and low-loss substrates," IEEE Trans. Microwave Theory Tech., Vol. 45, No. 10, pp. 1961-1968, Oct. 1997.
-
(1997)
IEEE Trans. Microwave Theory Tech
, vol.45
, Issue.10
, pp. 1961-1968
-
-
Burghartz, J.N.1
Edelstein, D.C.2
Jenkins, K.A.3
Kwark, Y.H.4
-
2
-
-
0029275983
-
Small-sized MMIC amplifiers using thin dielectric layers
-
March
-
S. Banba and H. Ogawa, "Small-sized MMIC amplifiers using thin dielectric layers," IEEE Trans. Microwave Theory Tech., Vol. 43, pp. 485-492, March 1995.
-
(1995)
IEEE Trans. Microwave Theory Tech
, vol.43
, pp. 485-492
-
-
Banba, S.1
Ogawa, H.2
-
3
-
-
0026395278
-
MMIC transmission lines for multi-layered MMIC's
-
June
-
H. Ogawa, T. Hasegawa, S. Banba, and H. Nakamoto, "MMIC transmission lines for multi-layered MMIC's," IEEE MTT-S Int. Microwave Symp. Dig., pp. 1067-1070, June, 1991.
-
(1991)
IEEE MTT-S Int. Microwave Symp. Dig
, pp. 1067-1070
-
-
Ogawa, H.1
Hasegawa, T.2
Banba, S.3
Nakamoto, H.4
-
4
-
-
0025070668
-
Multilayer MMIC using a 3 μm X 3-layer dielectric film structure
-
May
-
T. Tokumitsu, T. Hiraoka, H. Nakamoto, and T. Takenaka, "Multilayer MMIC using a 3 μm X 3-layer dielectric film structure," IEEE MTT-S Int. Microwave Symp. Dig., pp. 831-834, May 1990.
-
(1990)
IEEE MTT-S Int. Microwave Symp. Dig
, pp. 831-834
-
-
Tokumitsu, T.1
Hiraoka, T.2
Nakamoto, H.3
Takenaka, T.4
-
5
-
-
0024752583
-
Very small wide-band MMIC magic T's using microstrip lines on a thin dielectric film
-
Oct
-
T. Hiraoka, T. Tokumitsu, and M. Aikawa, "Very small wide-band MMIC magic T's using microstrip lines on a thin dielectric film," IEEE Trans. Microwave Theory Tech., Vol. MTT-37, pp. 1569-1575, Oct. 1989.
-
(1989)
IEEE Trans. Microwave Theory Tech
, vol.MTT-37
, pp. 1569-1575
-
-
Hiraoka, T.1
Tokumitsu, T.2
Aikawa, M.3
-
6
-
-
84897477231
-
RF transmission lines on silicon substrates
-
Munich, Germany, Oct. 5-7
-
G. E. Ponchak, "RF transmission lines on silicon substrates," 29 th European Microwave Conference Dig., Munich, Germany, Oct. 5-7, 1999, pp. 158-161.
-
(1999)
29 th European Microwave Conference Dig
, pp. 158-161
-
-
Ponchak, G.E.1
-
7
-
-
0036686741
-
High-Q factor three-dimensional inductors
-
Aug
-
B. Piernas, K. Nishikawa, K. Kamogawa, T. Nakagawa, and K. Araki, "High-Q factor three-dimensional inductors," IEEE Trans. Microwave Theory Tech., Vol. 50, No. 8, pp. 1942-1949, Aug. 2002.
-
(2002)
IEEE Trans. Microwave Theory Tech
, vol.50
, Issue.8
, pp. 1942-1949
-
-
Piernas, B.1
Nishikawa, K.2
Kamogawa, K.3
Nakagawa, T.4
Araki, K.5
-
8
-
-
0034239413
-
Embedded microstrip interconnection lines for gigahertz digital circuits
-
Aug
-
W. Ryu, S.-H. Baik, H. Kim, J. Kim, M. Sung, and J. Kim, "Embedded microstrip interconnection lines for gigahertz digital circuits," IEEE Trans. Advanced Packaging, Vol. 23, No. 3, pp. 495-503, Aug. 2000.
-
(2000)
IEEE Trans. Advanced Packaging
, vol.23
, Issue.3
, pp. 495-503
-
-
Ryu, W.1
Baik, S.-H.2
Kim, H.3
Kim, J.4
Sung, M.5
Kim, J.6
-
9
-
-
0032073279
-
Characterization of thin film microstrip lines on polyimide
-
May
-
G. E. Ponchak and A. N. Downey, "Characterization of thin film microstrip lines on polyimide," IEEE Trans. Components, Packaging, and Manufacturing Tech. -Part B, Vol. 21, No. 2, pp. 171-176, May 1998.
-
(1998)
IEEE Trans. Components, Packaging, and Manufacturing Tech. -Part B
, vol.21
, Issue.2
, pp. 171-176
-
-
Ponchak, G.E.1
Downey, A.N.2
-
10
-
-
0032090515
-
Measured attenuation of coplanar waveguide on CMOS grade silicon substrates with a polyimide interface layer
-
June 25
-
G. E. Ponchak and L. P. B. Katehi, "Measured attenuation of coplanar waveguide on CMOS grade silicon substrates with a polyimide interface layer," IEE Electronics Letters, Vol. 34, No. 13, pp. 1327-1329, June 25, 1998.
-
(1998)
IEE Electronics Letters
, vol.34
, Issue.13
, pp. 1327-1329
-
-
Ponchak, G.E.1
Katehi, L.P.B.2
-
11
-
-
0027540833
-
A coplanar-to-microstrip transition for W-band circuit fabrication with 100-μm-thick GaAs wafers
-
Feb
-
B. Golja, H. B. Sequeira, S. Duncan, G. Mendenilla, and N. E. Byer, "A coplanar-to-microstrip transition for W-band circuit fabrication with 100-μm-thick GaAs wafers," IEEE Microwave and Guided Wave Letters, Vol. 3, No. 2, pp. 29-31, Feb. 1993.
-
(1993)
IEEE Microwave and Guided Wave Letters
, vol.3
, Issue.2
, pp. 29-31
-
-
Golja, B.1
Sequeira, H.B.2
Duncan, S.3
Mendenilla, G.4
Byer, N.E.5
-
12
-
-
0028495838
-
Characterization of high frequency interconnects using finite difference time domain and finite element methods
-
Sept
-
J.-G. Yook, N. I. Dib, and L. P. B. Katehi, "Characterization of high frequency interconnects using finite difference time domain and finite element methods," IEEE Trans. Microwave Theory and Tech., Vol 42, No. 9, pp. 1727-1736, Sept. 1994.
-
(1994)
IEEE Trans. Microwave Theory and Tech
, vol.42
, Issue.9
, pp. 1727-1736
-
-
Yook, J.-G.1
Dib, N.I.2
Katehi, L.P.B.3
-
13
-
-
0027813660
-
Rigorous analysis of mixed transmission line interconnects using the frequency-domain TLM method
-
Dec
-
H. Jin, R. Vahldieck, J. Huang, and P. Russer, "Rigorous analysis of mixed transmission line interconnects using the frequency-domain TLM method," IEEE Trans. Microwave Theory and Tech., Vol. 41, No. 12, pp. 2248-2255, Dec. 1993.
-
(1993)
IEEE Trans. Microwave Theory and Tech
, vol.41
, Issue.12
, pp. 2248-2255
-
-
Jin, H.1
Vahldieck, R.2
Huang, J.3
Russer, P.4
-
14
-
-
0015161083
-
Properties of microstrip line on Si-SiO2 system
-
Nov
-
H. Hasegawa, M. Furukawa, and H. Yanai, "Properties of microstrip line on Si-SiO2 system," IEEE Trans. Microwave Theory and Tech., Vol. MTT-19, No. 11, pp. 869-881, Nov. 1971.
-
(1971)
IEEE Trans. Microwave Theory and Tech
, vol.MTT-19
, Issue.11
, pp. 869-881
-
-
Hasegawa, H.1
Furukawa, M.2
Yanai, H.3
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