Double-flip transfer of indium phosphide layers via adhesive wafer bonding and ion-cutting process

Applied Physics Letters

Volumn 90, Issue 5, 2007, Pages

  Chen, Wayne ^a   Chen, Peng ^a   Jing, Yi ^a   Lau, S S ^a   Kuech, T F ^b   Liu, Jiariu ^c   Wang, Xeimei ^c   Chu, Wei Kan ^c  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b University of Wisconsin Madison   (United States)

^c NONE

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; ELECTRIC PROPERTIES; ION IMPLANTATION; SILICON WAFERS; WSI CIRCUITS;

BENZOCYCLOBUTENE; ION CUTTING; THERMAL SEPARATION; WAFER BONDING;

SEMICONDUCTING INDIUM PHOSPHIDE;

EID: 33847003329     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2450665     Document Type: Article

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