Improvement of the thickness distribution of at cut quartz crystal wafer by open-air type plasma chemical vaporization machining

e-Journal of Surface Science and Nanotechnology

Volumn 5, Issue , 2007, Pages 41-44

  Yamamura, Kazuya ^a   Shibahara, Masafumi ^b   Sano, Yasuhisa ^a   Yamamoto, Yusuke ^a   Morikawa, Tetsuya ^a   Mori, Yuzo ^a  

^a OSAKA UNIVERSITY   (Japan)

^b HYOGO PREFECTURAL INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

Atmospheric pressure plasma; Plasma etching; Quartz crystal; Single crystal surfaces

Indexed keywords

ATMOSPHERIC PRESSURE; CRYSTALLINE MATERIALS; PLASMA DENSITY; PLASMA ETCHING; POLISHING; QUARTZ; VAPORIZATION; VIBRATIONS (MECHANICAL);

ATMOSPHERIC PRESSURE PLASMA; MECHANICAL MACHINING; SINGLE CRYSTAL SURFACES;

SINGLE CRYSTALS;

EID: 33846855566     PISSN: None     EISSN: 13480391     Source Type: Journal    
DOI: 10.1380/ejssnt.2007.41     Document Type: Conference Paper

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