Stress evolution in electrodeposited copper metallization during room-temperature aging

ECS Transactions

Volumn 1, Issue 11, 2006, Pages 93-103

  Chowdhury, T ^a   Ahmed, S ^a   Buckley, D N ^a   Laugier, M T ^a   Nakahara, S ^a   Heffernan, C ^a  

^a UNIVERSITY OF LIMERICK   (Ireland)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; ELECTRODEPOSITION; METALLIZING; POLYETHYLENE GLYCOLS; STRESS ANALYSIS; SUBSTRATES;

COPPER METALLIZATION; COPPER SULPHATE; ROOM-TEMPERATURE;

THIN FILMS;

EID: 33846805998     PISSN: 19385862     EISSN: 19386737     Source Type: Conference Proceeding    
DOI: 10.1149/1.2218481     Document Type: Conference Paper

References (18)

1. J. M. E. Harper, C. Carbal, Jr., P. C. Andricacos, L. Gignac, I. C. Noyan and K. P. Rodbell, J. Appl. Phys., 86, 2516 (1999).
2. G. R. Stafford, M. D. Vaudin, T. P. Moffat, N. Armstrong, V. D. Jovic and D. R. Kelley, Electrochem. Soc. Proceedings, Vol. 99-34, 340 (1999).
3. C. Lingk and M. E. Gross, J. Appl. Phys., 84, 5547 (1998).
4. J. W. Patten, E. D. McClanahan and J. W. Johnston, J. Appl. Phys., 42, 4371 (1971).
5. W. Bruckner and H. Griessmann, Rev. Sci. Instrum., 69, 3662 (1998).
6. V. A. Vasko, I. Tabakovic and S. C. Riemer, Elechem. Solid state. Lett., 6, 100 (2003).
7. H.-H. Hsu, K-H. Lin, S.-J. Lin and J.-W. Yeh, J. Electrochem. Soc., 148, 47 (2001).
8. D. N. Buckley and S. Ahmed, Electrochem. Solid State Lett, 6, C33 (2003).
9. S. Nakahara, S. Ahmed and D. N. Buckley, 206th Meeting of The Electrochemical Society, Honolulu, Hawaii, Abstract No. 913, October 3-8, (2004).
10. S. Ahmed, D. N. Buckley, S. Nakahara and Y. Kuo, MRS Proceedings, 863, B5.4 (2005).
11. S. Chowdhury and M. T. Laugier, Proc. of the International Conference on Metallurgical Coatings and Thin Films, San Diego, 2004.
12. S. Timoshenko, J. Opt. Soc., 11, 233 (1925).
13. G. G. Stoney, Proc. R. Soc. London Ser. A, 82, 172 (1909).
14. V. A. Vas'ko, I. Tabakovic, S. C. Riemer and M. T. Kief, Microelectronic Engineering, 75, 71 (2004).
15. H. Lee, S. S. Wong and S. D. Lopatin, J. Appl. Phys., 93, 3796 (2003).
16. K. Ueno, T. Eitzdorf and S.Grace, J. Appl. Phys., 86, 4930 (1999).
17. I. L. Newell, Metal Finishing, 58, 56 (1960).
18. N.P. Fedot'ev, Plating, 53, 309 (1966).