Die separation and packaging of a surface micromachined piezoresistive pressure sensor

Sensors and Actuators, A: Physical

Volumn 133, Issue 2 SPEC. ISS., 2007, Pages 457-466

  Clausen, Ingelin ^a   Sveen, Ola ^a  

^a UNIVERSITY OF OSLO   (Norway)

Author keywords

Dicing; Flip chip bonding; Medical application; MEMS design; Packaging; Piezoresistive pressure sensor

Indexed keywords

ELECTRONICS PACKAGING; FLIP CHIP DEVICES; INTEGRATED CIRCUIT LAYOUT; MEDICAL APPLICATIONS; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; SILICON WAFERS;

DICING; FLIP CHIP BONDING; MEMS DESIGN; PIEZORESISTIVE PRESSURE SENSORS;

SENSORS;

EID: 33846471070     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2006.05.011     Document Type: Article

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