Lead-free solder materials for sustainable development of green electronics in China

2005 6th International Conference on Electronics Packaging Technology

Volumn 2005, Issue , 2005, Pages 45-50

  Ma, Jusheng ^a   Chen, Guohai ^a  

^a TSINGHUA UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; ENVIRONMENTAL IMPACT; LAWS AND LEGISLATION; LEAD METALLURGY; RECYCLING; SUSTAINABLE DEVELOPMENT;

ELECTRONIC INDUSTRY; GREEN ELECTRONICS; LEAD FREE SOLDER ALLOYS; LEAD FREE SOLDER MATERIALS;

SOLDERING ALLOYS;

EID: 33846334431     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2005.1564657     Document Type: Conference Paper

References (13)

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11. Chen Guohai, Li Xiaoyan, Geng Zhiting, Ma Jusheng, "The Study on the New Type Lead-free Solder Alloys Sn-Zn-Ga", Rare Metal Materials & Engineering, Vol.33, No. 11 (2004), pp. 1222-1225.
12. CHEN Guohai, MA Jusheng, "The Mechanical Behavior of Sn-Ag4 Solder Joints Subjected to Thermal Cycling", Chinese Journal of Electronics, Vol.13, No.3 (2004), pp.416-418.
13. Jusheng Ma, "Development of Electronic Packaging Materials&Technology", Proceedings of the fourth international symposium on electronic packaging technology, Aug 8-11,2001, pp. 20-29.