Fabrication and properties of lead-free Sn-Ag-Cu-Ga solder alloy

Materials Science Forum

Volumn 475-479, Issue III, 2005, Pages 1747-1750

  Chen, Guohai ^a   Ma, Jusheng ^a   Geng, Zhiting ^a  

^a TSINGHUA UNIVERSITY   (China)

Author keywords

Hardness; Lead free solder; Melting point; Shear strength; Sn Ag Cu Ga; Spread ratio; Wetting angle

Indexed keywords

ANGLE MEASUREMENT; BINARY ALLOYS; COMPOSITION; ELECTRONIC EQUIPMENT MANUFACTURE; EUTECTICS; HARDNESS; LEAD; SYNTHESIS (CHEMICAL); WETTING;

LEAD-FREE SOLDER; MELTING POINT; SN-AG-CU-GA; SPREAD RATIO; WETTING ANGLE;

SOLDERING ALLOYS;

EID: 17044400206     PISSN: 02555476     EISSN: 16629752     Source Type: Book Series    
DOI: 10.4028/0-87849-960-1.1747     Document Type: Conference Paper

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