Current Status of Low Temperature Lead-Free Soldering in Market

Journal of Japan Institute of Electronics Packaging

Volumn 6, Issue 5, 2003, Pages 369-374

  Suganuma, Katsuaki ^a  

^a OSAKA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 84973458852     PISSN: 13439677     EISSN: 1884121X     Source Type: Journal    
DOI: 10.5104/jiep.6.369     Document Type: Article

References (3)

1. “Lead-Free Solder Project Final Report”, NCMS Report 0401RE96, National Center for Manufacturing Sciences, Michigan, 1997.
2. “Second European Lead-Free Soldering Technology Roadmap”, Soldertech, London, 2003.
3. K. Suganuma: “Advances in Lead-Free Electronics Soldering”, Current Opinion in Solid State and Materials Science, Vol.5, No.1, pp.555-564, 2001.