The mechanical behavior of Sn-Ag4 solder joints subjected to thermal cycling

Chinese Journal of Electronics

Volumn 13, Issue 3, 2004, Pages 416-418

  Chen, Guohai ^a   Ma, Jusheng ^a  

^a TSINGHUA UNIVERSITY   (China)

Author keywords

Sn Ag4 solder; Solder joint; Stress strain hysteresis loops; Thermal cycling

Indexed keywords

BINDING ENERGY; COPPER; CRACKS; CRYSTAL LATTICES; DEGRADATION; DIFFUSION; ELASTIC MODULI; FINITE ELEMENT METHOD; HYSTERESIS; STRAIN GAGES; STRESS ANALYSIS; THERMAL CYCLING;

HYSTERESIS LOOPS; MECHANICAL BEHAVIOR; SHEAR STRAIN; THERMAL FATIGUE;

SOLDERED JOINTS;

EID: 3242891794     PISSN: 10224653     EISSN: 20755597     Source Type: Journal    
DOI: None     Document Type: Article

References (9)

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