Delamination prediction in stacked back-end structure underneath bond pads

2005 6th International Conference on Electronics Packaging Technology

Volumn 2005, Issue , 2005, Pages

  Van Hal, B A E ^a   Zhang, G Q ^b   Van Gils, M A J ^b,c   Peerlings, R H J ^a  

^a EINDHOVEN UNIVERSITY OF TECHNOLOGY   (Netherlands)

^b NXP SEMICONDUCTORS   (Netherlands)

^c PHILIPS RESEARCH LABORATORIES   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; DELAMINATION; FINITE ELEMENT METHOD; INTERFACES (MATERIALS); MATHEMATICAL MODELS; PARAMETER ESTIMATION;

EXPONENTIAL TRACTION SEPARATION LAW; INTERFACE DAMAGE MECHANICS (IDM); LINEAR ELASTIC FRACTURE MECHANICS; THERMOMECHANICAL RELIABILITY;

INTEGRATED CIRCUITS;

EID: 33846329789     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2005.1564639     Document Type: Conference Paper

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