Fracture in thin-film structures for device technologies: New material and length scale challenges

11th International Conference on Fracture 2005, ICF11

Volumn 1, Issue , 2005, Pages 689-693

  Litteken, C L ^a   Dauskardt, R H ^a  

^a Stanford University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHANNEL LENGTH; CHEMICAL-MECHANICAL PLANARIZATION; DEBONDED INTERFACES; DEVICE ARCHITECTURES; DEVICE PACKAGING; DEVICE PROCESSING; DEVICE TECHNOLOGIES; DIFFUSION RESISTANCE; FRACTURE BEHAVIOR; INTER-LAYER DIELECTRICS; INTERFACIAL ADHESIONS; LENGTH SCALE; LINE STRUCTURES; LOW-K MATERIALS; MECHANICAL INTEGRITY; MECHANICAL PERFORMANCE; METAL LINE; PATTERNED ARRAYS; TECHNOLOGY NODES; THIN-FILM GEOMETRY; THIN-FILM STRUCTURE; ULTRA LOW-K DIELECTRICS;

ADHESION; ASPECT RATIO; CHEMICAL MECHANICAL POLISHING; COPPER; DIELECTRIC MATERIALS; DIELECTRIC PROPERTIES; FRACTURE MECHANICS; INTERFACES (MATERIALS); THIN FILM DEVICES;

FRACTURE;

EID: 84869835815     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. M. Lane, A. Vainchtein, H. Gao, and R. H. Dauskardt, "Plasticity Contributions to Interface Adhesion in Thin-Film Interconnect structures," J. Mat. Res., 15 [12], 2758-2769, 2000.
2. R. J. Hohlfelder, D. A. Maidenberg, R. H. Dauskardt, Y. Wei, and J. W. Hutchinson, "Adhesion of Benzocyclobutine-Passivated Silicon in Epoxy Layered Structures," J. Mat. Res., 16 [1], 243-255, 2000.
3. M. Lane, N. Krishna, I. Hashim, and R. H. Dauskardt, "Adhesion and Reliability of Copper Interconnects with Ta and TaN Barrier Layers," J. Mat. Res., 15 [1] 203-211, 2000.
4. S. Stroband and R. H. Dauskardt, "Interface Separation in Residually Stressed Thin-Film Structures," Interface Science special issue on "Mechanics of Interfaces," 11, 309-317, 2003.
5. C. Litteken and R. H. Dauskardt, "Adhesion of Polymer Thin-Films and Patterned Lines," Int. J. Fract., 119/120, 475-485, 2003.