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Volumn 515, Issue 6, 2007, Pages 3305-3309

Fracture toughness measurement of thin films on compliant substrate using controlled buckling test

Author keywords

Controlled buckling test; Fracture toughness; Intermetallic compound; Thin film fracture

Indexed keywords

BUCKLING; CRACK INITIATION; FINITE ELEMENT METHOD; FRACTURE TOUGHNESS; INTERMETALLICS; PARAMETER ESTIMATION;

EID: 33846320393     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2006.01.044     Document Type: Article
Times cited : (23)

References (21)
  • 11
    • 0038688993 scopus 로고    scopus 로고
    • Proceedings of the 53rd Electronic Component and Technology Conference, 27-30 May 2003, New Orleans USA, IEEE
    • Chen Z., Cahyadi T., Li M., Balakrisnan B., and Chum C.C. Proceedings of the 53rd Electronic Component and Technology Conference, 27-30 May 2003, New Orleans USA, IEEE (2003) 844
    • (2003) , pp. 844
    • Chen, Z.1    Cahyadi, T.2    Li, M.3    Balakrisnan, B.4    Chum, C.C.5
  • 21
    • 0000954018 scopus 로고
    • Cieslak M.J., Perepezko J.H., Kang S., and Glicksman M.E. (Eds), TMS, Warrendale PA
    • Fields R.J., Low III S.R., and Lucey Jr. G.K. In: Cieslak M.J., Perepezko J.H., Kang S., and Glicksman M.E. (Eds). The Metal Science of Joining (1992), TMS, Warrendale PA 165-173
    • (1992) The Metal Science of Joining , pp. 165-173
    • Fields, R.J.1    Low III, S.R.2    Lucey Jr., G.K.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.