Realization and electrical characterization of ultrathin crystals of layered transition-metal dichalcogenides

Journal of Applied Physics

Volumn 101, Issue 1, 2007, Pages

  Ayari, Anthony ^a,b   Cobas, Enrique ^c   Ogundadegbe, Ololade ^c   Fuhrer, Michael S ^c  

^a Bldg 142   (United States)

^b UNIVERSITÉ LYON 1   (France)

^c NONE

Author keywords

[No Author keywords available]

Indexed keywords

CHARGE DENSITY; CHEMICAL EXFOLIATION; MECHANICAL PEELING; ULTRATHIN CRYSTALS;

ELECTRON BEAM LITHOGRAPHY; PEELING; SUPERCONDUCTING TRANSITION TEMPERATURE; TRANSITION METALS;

CRYSTALLINE MATERIALS;

EID: 33846295541     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2407388     Document Type: Article

References (21)

1. S. R. Forrest, Nature (London) 428, 911 (2004).
2. D. J. Gundlach, Y. Y. Lin, T. N. Jackson, S. F. Nelson, and D. G. Schlom, IEEE Electron Device Lett. 18, 87 (1997).
3. X. Duan, C. Niu, V. Sahi, J. Chen, J. Wallace Parce, S. Empedocles, and J. L. Goldman, Nature (London) 425, 274 (2003).
4. D. B. Mitzi, L. L. Kosbar, C. E. Murray, M. Copel, and A. Afzali, Nature (London) 428, 299 (2004).
5. V. Podzorov, M. E. Gershenson, Ch. Kloc, R. Zeis, and E. Bucher, Appl. Phys. Lett. 84, 3301 (2004).
6. S. Novoselov, D. Jiang, F. Schedin, T. J. Booth, V. V. Khotkevich, S. V. Morozov, and A. K. Geim, Proc. Natl. Acad. Sci. U.S.A. 102, 10451 (2005).
7. Y. Zhang, Y.-W. Tan, H. L. Stormer, and P. Kim, Nature (London) 438, 201 (2005).
8. C. Berger et al., Science 312, 1191 (2006).
9. R. F. Frint, J. Appl. Phys. 37, 1938 (1966).
10. F. Consadori and R. F. Frindt, Phys. Rev. B 2, 4893 (1970).
11. R. F. Frindt, Phys. Rev. Lett. 28, 299 (1972).
12. P. Joensen, R. F. Frindt, and S. R. Morrison, Mater. Res. Bull. 21, 457 (1986).
13. Non-Tetrahedrally Bonded Binary Compounds II, Landolt-Börnstein, Condensed Matter Group III, Vol. 41, Pt. D (Springer-Verlag, Heidelberg, 2000).
14. A. Manivannan, Y. Santiago, and C. R. Cabrera, J. Vac. Sci. Technol. B 12, 2111 (1994).
15. A. H. Thompson, F. R. Gamble, and R. F. Koehler, Jr., Phys. Rev. B 5, 2811 (1972).
16. J. A. Wilson, F. J. Di Salvo, and S. Mahajan, Adv. Phys. 24, 117 (1975).
17. J. F. Revelli, Jr. and W. A. Phillips, J. Solid State Chem. 9, 176 (1974).
18. M. Alexe and U. Gosele, Wafer Bonding (Springer, New York, 2004).
19. K. Ueno, K. Saiki, T. Shimada, and A. Koma, J. Vac. Sci. Technol. A 8, 68 (1990).
20. J. Zhang, J. Liu, J. L. Huang, P. Kim, and C. M. Lieber, Science 274, 757 (1996).
21. D. J. Huntley, Phys. Rev. Lett. 36, 490 (1976).