An energy method to analyze through thickness thin film fracture during indentation

Thin Solid Films

Volumn 515, Issue 6, 2007, Pages 3298-3304

  Morasch, K R ^a   Bahr, D F ^a  

^a WASHINGTON STATE UNIVERSITY   (United States)

Author keywords

Energy; Fracture; Thin films

Indexed keywords

ALUMINUM COMPOUNDS; BINDING ENERGY; CRACK INITIATION; INDENTATION; NANOSTRUCTURED MATERIALS; THIN FILMS;

BRITTLE THIN OXIDE FILMS; COMPLIANT SUBSTRATES; FILM THICKNESS; NANOINDENTATION;

FRACTURE;

EID: 33846281142     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2006.01.043     Document Type: Article

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