Study of MEMS packaging technology

2005 6th International Conference on Electronics Packaging Technology

Volumn 2005, Issue , 2005, Pages

  Zhang, Yufeng ^a   Tan, Xiaoyun ^a   Chen, Weiping ^a   Zhang, Guowei ^a   Liu, Xiaowei ^a  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ACCELEROMETERS; DIGITAL INTEGRATED CIRCUITS; MICROELECTROMECHANICAL DEVICES; SENSORS;

ACOUSTIC VIBRATION SENSORS; MICROACCELEROMETERS; MICROELECTROMECHANICAL PACKAGING TECHNOLOGY;

ELECTRONICS PACKAGING;

EID: 33846274558     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2005.1564712     Document Type: Conference Paper

References (6)

1. Liwei, Lin, "MEMS Post-Packaging by Localized Heating and Bonding," IEEE Trans-Advanced Packaging, Vol. 23, No. 4 (2000), pp. 608-616.
2. th Electronic Components and Technology Conf, Seattle, WA, May. 1998, pp. 592-597. [A reference to a presentation at a Conference...]
3. Chiou J. Albert, et al, "Special Issue on MEMS/NEMS Packaging," IEEE Trans-Advanced Packaging, Vol. 26, No.3(2004), pp. 215-216.
4. Chiou J. Albert, et al, "Application of Specific MEMS/NEMS Packaging: Introduction," American Society of Mechanical Engineerings, Vol. 3(2003), pp. 41
5. Wei. J, et al, "A Packaging Solution for Pressure sensor MEMS," American Society of Mechanical Engineerings, Vol. 3(2003), pp. 113-118
6. Evans J.R., et al, "Advanced in MEMS Packaging: Design Considerations," Advanced Packaging, Vol. 13, No. 4(2004), pp. 19-21