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Volumn 13, Issue 4, 2004, Pages 19-21
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Advances in MEMS Packaging: Design considerations
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Author keywords
[No Author keywords available]
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Indexed keywords
ELECTRICAL SHIELDING;
INTEGRATED CIRCUIT (IC) PACKAGING;
SINGULATION;
TECHNOLOGY SEGMENTATION;
CHEMICAL BONDS;
COST BENEFIT ANALYSIS;
DESIGN;
FORECASTING;
INTEGRATED CIRCUITS;
MICROELECTROMECHANICAL DEVICES;
MICROPROCESSOR CHIPS;
OPTICAL INTERCONNECTS;
SEALS;
SEMICONDUCTOR DEVICE MANUFACTURE;
SILICON WAFERS;
PACKAGING;
CHEMICAL BONDS;
PACKAGING;
SEALS;
SEMICONDUCTOR DEVICES;
SILICON;
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EID: 2342485099
PISSN: 10650555
EISSN: None
Source Type: Trade Journal
DOI: None Document Type: Article |
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Times cited : (5)
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References (0)
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