A packaging solution for pressure sensor MEMS

American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP

Volumn 3, Issue , 2003, Pages 113-118

  Wei, J ^a   Qi, G J ^a   Wang, Z F ^a   Jin, Y F ^a   Lim, P C ^a   Wong, C K ^a  

^a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

Author keywords

Bonding; Etching; Pressure sensor; Re routing; Vacuum sealing; Wafer level packaging

Indexed keywords

ADHESIVES; BONDING; ETCHING; MATHEMATICAL MODELS; METALLIZING; MICROELECTRONICS; MICROMACHINING; PACKAGING; PARTIAL PRESSURE SENSORS; SILICON WAFERS;

PRESSURE SENSORS; RE-ROUTING; VACUUM SEALING; WAFER LEVEL PACKAGING;

MICROELECTROMECHANICAL DEVICES;

EID: 1942536578     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2003-42824     Document Type: Conference Paper

References (10)

1. B. Ziaie, J. A. Von Arx, M. R. Dokmeci, and K. Najafi, "A hermetic glass-silicon micropackage with high-density on-chip feedthroughs for sensors and actuators," J. Microelectromech. Syst., vol. 5, pp 166-179, Sept. 1996.
2. M. A. Schmidt, "Wafer-to-wafer bonding for microstructure formation," Proc. of the IEEE, vol. 86, pp.1575-1585, Aug. 1998.
3. W. H. Ko, J. T. Suminto, and G. J. Yeh, "Bonding techniques for microsensors," in micromachining and Micropackaging for Transducers. Amsterdam, The Netherlands: Elsevier, 1985.
4. H. Guckel and D. W. Burns, "Planar processes polysilicon sealed cavities for pressure transducer arrays," Tech. Dig. IEEE IEDM, pp.223-225, 1984.
5. A. V. Chavan and K. D. Wise, "A batch-processed vacuum sealed capacitive pressure sensor," Proc. Thansducers'97, pp. 1449-1452, 1997.
6. L. Lin, K. M. McNair, R. T. Howe and A. P. Pisano, "Vacuum encapsulated lateral microresonators," Proc. Thansducers'93, pp.270-273, 1993.
7. G. D. Wallis and D. I. Pomerantz, "Field assisted glass-metal sealing," J. App. Phys., vol. 40, pp. 3946-3948, 1969.
8. T. Rogers and J. Kowal, "Selection of glass, anodic bonding conditions and material compatibility for silicon-glass capacitive sensors," Sens Actuators A, vol. 46-47, pp. 113-120, 1995.
9. H. Henmi, S. Shoji, Y. Shoji, K. Yoshimi, and M. Esashi, "Vacuum packaging for microsensors by glass-silicon anodic bonding," Sens Actuators A, vol. 43, pp. 243-248, 1994.
10. J. Wei, H. Xie, M. L. Nai, C. K. Wong and L. C. Lee, "Low temperature wafer anodic bonding," J. Micromech. Microeng., vol. 13, pp. 217-222, 2003.