Special Issue on MEMS/NEMS Packaging

IEEE Transactions on Advanced Packaging

Volumn 26, Issue 3, 2003, Pages 215-216

  Lee, Y C ^a   Chiou, J Albert ^b   Chen, Shaochen ^c   Jung, Eric ^d  

^a UNIVERSITY OF COLORADO   (United States)

^b MOTOROLA INC   (United States)

^c The University of Texas at Austin   (United States)

^d FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0142196119     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2003.817823     Document Type: Editorial

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