Application of Specific MEMS/NEMS Packaging: Introduction

American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP

Volumn 3, Issue , 2003, Pages 41-

  Chiou, J Albert ^a   Jung, Erik ^b   Lin, Liwei ^c   Liu, Sheng ^d   Chen, Shaochen ^e   Chiang, Kuo Ning ^f   Lee, Y C ^g  

^a MOTOROLA INC   (United States)

^b FRAUNHOFER IZM   (Germany)

^c UNIVERSITY OF CALIFORNIA   (United States)

^d WAYNE STATE UNIVERSITY   (United States)

^e UNIVERSITY OF TEXAS AT AUSTIN   (United States)

^f NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^g UNIVERSITY OF COLORADO   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 1942536609     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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