Thermal peel, warpage and interfacial shear stresses in adhesive joints

Journal of Adhesion Science and Technology

Volumn 17, Issue 1, 2003, Pages 115-128

  Rossettos, John N ^a  

^a NORTHEASTERN UNIVERSITY   (United States)

Author keywords

Adhesive joints; Analytical solutions; Beam bending; Shear lag model; Thermal stress; Warping

Indexed keywords

ADHESIVES; BENDING (DEFORMATION); PEELING; SHEAR STRESS; STRAIN; THERMAL STRESS; ADHESIVE JOINTS;

SHEAR STRAINS;

ADHESIVE JOINTS; BENDING (DEFORMATION);

ADHERENDS; ANALYTICAL SOLUTIONS; BEAM BENDING; EPOXY ADHESIVES; INTERFACIAL SHEAR STRESS; INTERIOR POINT; MODIFIED SHEAR LAG MODEL; OVERLAP REGION; SHEAR-LAG MODEL; SINGLE LAP JOINTS; TEMPERATURE CHANGES; THERMAL MISMATCH; WARPAGES; WARPING;

EID: 0037285199     PISSN: 01694243     EISSN: None     Source Type: Journal    
DOI: 10.1163/15685610360472475     Document Type: Article

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