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Volumn , Issue , 2005, Pages 539-546

Spatial variability of critical dimensions

Author keywords

[No Author keywords available]

Indexed keywords

DEGREE OF CORRELATIONS; GATE LENGTH VARIATION; INTERMEDIATE REGIMES; NON-STATIONARY BEHAVIORS; SEPARATION DISTANCES; SPATIAL CORRELATION STRUCTURES; SPATIAL CORRELATIONS; SYSTEMATIC VARIATION;

EID: 33846118531     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (4)

References (8)
  • 1
    • 0031077147 scopus 로고    scopus 로고
    • Analysis and decomposition of spatial variation in integrated circuit processes and devices
    • Feb.
    • B. E. Stine, D. S. Boning, and J. E. Chung, "Analysis and decomposition of spatial variation in integrated circuit processes and devices," IEEE Transactions on Semiconductor Manufacturing, vol. 10, no. 1, Feb. 19.
    • IEEE Transactions on Semiconductor Manufacturing , vol.10 , Issue.1 , pp. 19
    • Stine, B.E.1    Boning, D.S.2    Chung, J.E.3
  • 8
    • 0036474722 scopus 로고    scopus 로고
    • Impact of die-to-die and within-die parameter fluctuations on the maximum clock frequency distribution for gigascale integration
    • K. Bowman, S. Duvall, and J. Meindl, "Impact of Die-to-Die and Within-Die Parameter Fluctuations on the Maximum Clock Frequency Distribution for Gigascale Integration," IEEE Journal of Solid-State Circuits, vol. 37, no.2,pp. 183-190,2002.
    • (2002) IEEE Journal of Solid-State Circuits , vol.37 , Issue.2 , pp. 183-190
    • Bowman, K.1    Duvall, S.2    Meindl, J.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.