TiN membrane for MEMS applications

Chinese Journal of Sensors and Actuators

Volumn 19, Issue 5, 2006, Pages

  Yang, Mei ^a,b   Shu, Qiong ^a   Chen, Jing ^a,b  

^a PEKING UNIVERSITY   (China)

^b INSTITUTE OF GEOLOGY AND GEOPHYSICS   (China)

Author keywords

Annealing; MEMS; Sputtering; Stress; TiN

Indexed keywords

EID: 33845985250     PISSN: 10041699     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (12)

1. Plummer J D, Deal M D, Griffin P B. Silicon VLSI Technology[M]. Prentice Hall, Upper Saddle River, New Jersey.
2. Lacerda M M, Chen Y H, Zhou B, et al. Synthesis of Hard TiN Coatings with Suppressed Columnar Growth and Reduced Stress[J]. Journal of Vacuum Science and Technology A, 1999, 17(5): 2915-2919.
3. Lim J W, Park H S, Park T H, et al. Mechanical Properties of Titanium Nitride Coatings Deposited by Inductively Coupled Plasma Assisted Direct Current Magnetron Sputtering [J]. Journal of Vacuum Science and Technology A, 2000, 18(2): 524-528.
4. Creemer J F, Sarro P M, Laros M, et al. Titanium Nitride for MEMS Hotplates[J]. Semiconductor adv for future electronics, 2004: 742-746.
5. Patsalas P, Charitidis C, Logothetidis & The Effect of Substrate Temperature and Biasing on the Mechanical Properties and Structure of Sputtered Titanium Nitride thin Films [J]. Surface and Coatings Technology, 2000, 125(1-3): 335-340.
6. Choe H S, Danek M. MOCVD TiN Diffusion Barriers for Copper Interconnects[J]. IEEE 1999: 63-64.
7. Rajan N, Zorman C. 3C-SiC Coating of Silicon Micromachined Atomizers[J]. Proceedings of Micro Electro Mechanical Systems, 1997:165-168.
8. Christian Under, David Fork, Christopher Chua et al. Stressed Metal Nanosprings Applications in Interconnect and Passive Components[J]. Advanced Packaging, November, 2002.
9. Jeffrey L. Perry. Effects of Sputter Deposition Parameters on Stress in Tantalum Films with Applications to Chemical Mechanical Planarization of Copper [D], Microsystem engineering Ruchest, Institute of Technology Ruchest U. S. A.
10. Bilek M M M, Tarrant R N, McKenzie D R, et al. Control of Stress and Microstructure in Cathodic arc Deposited Films, IEEE Transactions on Plasma Science, 2003,31(5): 939-944.
11. Karimi A, Shojaei O R, Krumj T, et al. Characterization of TiN Thin Films Using the Bulge Test and the Nanoindentation Technique[J]. Thin Solid Films, 1997, 308-309(1-4): 334-339. http://www.finishing.com/178/71.shtml[EB/OL].
12. http://www.finishing.com/178/71. shtml[EB/OL].